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| (R) 1N5908 SM5908 TRANSILTM FEATURES UNIDIRECTIONAL TRANSIL DIODE PEAK PULSE POWER : 1500 W (10/1000s) REVERSE STAND OFF VOLTAGE : 5 V LOW CLAMPING FACTOR FAST RESPONSE TIME UL RECOGNIZED DESCRIPTION The 1N5908 and SM5908 are dedicated to the 5 V logiccircuit protection(TTL and CMOS technologies). Their low clamping voltage at high current level guarantees excellent protection for sensitive components. ABSOLUTE MAXIMUM RATINGS (Tamb = 25C). Symbol PPP P IFSM Tstg Tj TL Parameter Peak pulse power dissipation (see note1) Power dissipation on infinite heatsink Non repetitive surge peak forward current for unidirectional types Storage temperature range Maximum junction temperature Maximum lead temperature for soldering during 10s (at 5mm from case for CB429) CB429 SMC Tj initial = Tamb Tamb = 75C tp = 10ms Tj initial = Tamb Value 1500 5 200 - 65 to + 175 175 230 260 Unit W W A C C C C CB429 SMC Note 1 : For a surge greater than the maximum values, the diode will fail in short-circuit. THERMAL RESISTANCES Symbol Rth (j-l) Rth (j-a) Junction to leads Junction to ambient on printed circuit. L lead = 10 mm On recommended pad layout CB429 SMC Parameter Value 20 75 75 Unit C/W C/W C/W August 1999 Ed : 2A 1/6 1N5908/SM5908 ELECTRICAL CHARACTERISTICS(Tamb = 25C) I Symbol VRM VBR VCL IRM IPP Parameter Stand-offvoltage Breakdown voltage Clamping voltage Leakage current @ VRM Peak pulse current Voltage temperature coefficient VCL VBR VRM IF VF IRM V T VF IPP Forward voltage IRM @ VRM Types max VBR @ IR min note2 VCL @ IPP max 10/1000s V 7.6 A 30 VCL @ IPP max 10/1000s V 8 A 60 VCL @ IPP max 10/1000s V 8.5 A 120 T max note3 10 /C 5.7 -4 C typ note4 pF 9500 A 1N5908 SM5908 300 V 5 V 6 mA 1 % IPP 100 10 s Fig. 1: Peak pulse power dissipation versus initial junction temperature (printed circuit board). 50 0 1000 s t Note 2 : Note 3 : Note 4 : Pulse test : tp < 50ms VBR = T*(Tamb-25)* VBR (25C). VR = 0V, F = 1 MHz 2/6 1N5908/SM5908 Fig. 2 : Peak pulse power versus exponential pulse duration. Fig. 3 : Clamping voltage versus peak pulse current. Exponential waveform tp = 10 ms............... tp = 1 ms------------tp = 20 s________ Note : The curves of the figure 3 are specified for a junction temperature of 25 C before surge. The given results may be extrapolated for other junction temperatures by using the following formula : VBR = T *(Tamb - 25) * VBR (25C). 3/6 1N5908/SM5908 Fig. 4 : Capacitance versus reverse applied voltage (typical values). Fig. 5 : Peak forward voltage drop versus peak forward current. Fig. 6a/6b : Transient thermal impedance junction-ambientversus pulse duration. Fig. 6a : CB429 Package. (For FR4 PC Board with L lead = 10 mm) Fig. 6b : SMC Package. Mounting on FR4 PC Board with recommended pad layout. Fig. 7 : Relative variation of leakage current versus junction temperature. 4/6 1N5908/SM5908 ORDER CODE 1N5908 RL Device code Packaging : = Ammopack tape RL = Tape and reel SM 5908 Numerical code Surface mount MARKING : Logo, type code and cathode band Package SMC CB429 Type SM5908 1N5908 Marking MDC 1N5908 A white band indicates the cathode PACKAGE MECHANICAL DATA SMC (Plastic) DIMENSIONS REF. E1 Millimeters Min. Max. 2.45 0.20 3.2 0.41 8.15 7.15 4.70 6.25 1.60 1.90 0.05 2.90 0.15 7.75 6.60 4.40 5.55 0.75 Inches Min. 0.075 0.002 0.114 0.006 0.305 0.260 0.173 0.218 0.030 Max. 0.096 0.008 0.126 0.016 0.321 0.281 0.185 0.246 0.063 A1 D A2 b c E E E1 A1 E2 C E2 L A2 D b L FOOT PRINT (in millimeters) 3.3 2.0 4.2 2.0 Packaging : Standardpackagingis in tape and reel. Weight = 0.25 g. 5/6 1N5908/SM5908 PACKAGE MECHANICAL DATA CB429 (Plastic) DIMENSIONS Millimeters Inches Min. A B C D L1 9.45 26 4.90 0.94 5.00 1.00 Typ. 9.50 Max. Min. Typ. Max. 9.80 0.372 0.374 0.386 1.024 5.10 0.193 0.197 0.201 1.06 0.037 0.039 0.042 1.27 0.050 REF. Note : The lead is not controlled within zone L1 Packaging : Standardpackagingis in tape and reel. Weight = 0.85 g. Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 1999 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 6/6 |
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